We are looking for a Lead Electrical Engineer with 10+ years of experience to own the full electrical architecture of a next-generation consumer neural wearable. You will be a foundational hire responsible for tying together audio, video, sensor, compute, and communication subsystems into a cohesive product, from schematic through production ramp. This is a deeply hands-on technical leadership role where you will build the EE team from scratch, drive critical SoC selection decisions, and partner with external JDM partners while maintaining full accountability. You must have shipped at least one consumer electronics product under your technical leadership and be comfortable operating with high ambiguity in a fast-moving startup environment.
What will you be doing?
Own the entire electrical architecture of the wearable platform: compute partitioning, sensor integration, power management, RF/wireless, and SI/PI across flex and rigid-flex PCB designs.
Evaluate and select the SoC and key components, driving genuine trade-off analyses and BOM ownership with second-source strategy.
Identify organizational needs, build out the EE team, and determine what to build internally vs. outsource to external partners (build, rent, or partner model).
Lead hardware bring-up and debug at the electrical layer, unblocking firmware and subsystem leads while driving DFM/DFT through contract manufacturers.
Operate as a hands-on technical leader: architecting at the system level while jumping into the weeds when problems arise, shipping the first product by early next year.
- 10-20 years of experience in consumer electronics electrical engineering, with shipped product under technical leadership
- Shipped a consumer electronics product as technical lead (wearable, audio, mobile, or comparable)
- Built a team or function from scratch (0-to-1), not inherited a large org
- Experience with EEG, biopotential, or high-density sensor array systems
- System-level mixed-signal design across multiple subsystems (audio, video, compute, sensors, comms)
- Flex/rigid-flex PCB design with SI/PI sign-off experience
- SoC evaluation, BOM ownership, and second-source strategy on shipped products
- Thrives in ambiguity and can define next steps without a playbook
- BS or higher in Electrical Engineering or related field
- Mixed-signal PCB design (flex/rigid-flex), SI/PI analysis, multi-MCU architecture
- RF/wireless (Wi-Fi, BLE), power management (PMIC, battery management, USB-C)
- Sensor AFEs (EEG/biopotential), audio DSP, camera/ISP interfaces
- SoC evaluation and selection, DFM/DFT/DFA